Intel 240×240mm AI package… projected to have 32 HBM and 70+ bridges
Original headline인텔 240×240㎜ AI 패키지…HBM 32개·브리지 70개 이상 전망
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Intel unveiled at ISMP 2026 in Busan a roadmap for a 240×240mm AI chip package carrying more than 32 HBM stacks and over 70 EMIB bridges, with foundry packaging director Lee Kyu-oh positioning EMIB-T as a flexible architecture that places high-density silicon only where needed. The plan has three stages: a commercial tier this year at up to 120×120mm with 12 HBM stacks and more than 20 bridges, a development tier above 120×180mm targeting at least 16 HBM stacks and over 38 bridges, and the 240×240mm flagship. The roadmap matters because package size and bridge count are becoming the binding constraints on scaling AI accelerators as reticle limits bite. Watch for whether Intel lands the 120×120mm tier on schedule this year and whether HBM and substrate suppliers can support 32-stack packages.
Muhabbit's AI wrote this summary in its own words from TokenPost's report and translated it from Korean. It can get details wrong, so check the source.
Named in this story
Intel (INTC), EMIB, HBM, ISMP 2026, Lee Kyu-oh
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