Industry pushback on TSMC 3D DRAM production claims… storage cells remain the domain of memory companies

TSMC is reportedly reviewing plans to produce 3D DRAM at Nvidia's request, though no start date has been given, according to The Information. Taiwan industry sources pushed back on the idea that TSMC would make the memory cells themselves, arguing its likely role is limited to HBM4 base die manufacturing and SoIC advanced packaging, while storage-cell production stays with memory makers. The distinction matters because it defines how far TSMC can encroach on the turf of Samsung, SK Hynix and Micron in the AI memory supply chain. Watch for clarity on whether TSMC builds new capacity or converts existing plants, and for confirmation of its HBM4 base-die and packaging scope.