₩46 trillion Onyang HBM expansion… Samsung Electronics begins construction of Line 5

Samsung Electronics broke ground on its fifth HBM advanced packaging line at its Onyang campus in Asan, South Chungcheong Province, as part of a 46 trillion won ($33 billion) plan to build five HBM production lines there, with 6 trillion won earmarked for construction and 40 trillion won for advanced equipment. The new line will include roughly 31,000 square meters of cleanroom space across three floors, expanding the campus's total floor area from 270,000 to 420,000 square meters. Samsung is targeting June 2028 for the line to begin operations, about a year ahead of its previous schedule, converting the site from a chip assembly and test hub into an HBM back-end processing base. The investment underscores Samsung's push to scale HBM capacity amid surging AI memory demand and to close the gap with rivals in the high-bandwidth memory market. Watch for equipment procurement timelines and any further acceleration of the remaining four lines.